Planarization of Cu and Ta using silica and alumina abrasives - A comparison

Materials Research Society Symposium - Proceedings

Volumn 613, Issue , 2000, Pages

  Li, Y ^a   Ramarajan, S ^a   Hariharaputhiran, M ^a   Her, Y S ^a   Babu, S V ^a  

^a Clarkson University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ALUMINA; COPPER; HARDNESS; PH EFFECTS; RATE CONSTANTS; SILICA; SLURRIES; TANTALUM; WEAR OF MATERIALS;

GLYCINE; IRON NITRATE; POLISH RATE;

CHEMICAL MECHANICAL POLISHING;

EID: 0034432890     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-613-e2.4.1     Document Type: Conference Paper

References (10)

1. Chemical-mechanical polishing of Ta
2. Stabilization of alumina slurry for chemical-mechanical polishing of copper
3. Hardness of sub-micrometer abrasive particles and polish rate measurements
4. Chemical processes in glass polishing
5. Chemical-mechanical polishing of copper and tantalum with silica abrasives
6. Effect of pH and ionic strength on the chemical-mechanical polishing of tantalum