Characterization and integration in Cu damascene structures of AURORA, an inorganic low-k dielectric

Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D5141-D5146

  Donaton, R A ^a   Coenegrachts, B ^a   Sleeckx, E ^a   Schaekers, M ^a   Sophie, G ^b   Matsuki, N ^b   Baklanov, M R ^a   Struyf, H ^a   Lepage, M ^a   Vanhaelemeersch, S ^a   Beyer, G ^a   Stucchi, M ^a   De Roest, D ^a   Maex, K ^c  

^a IMEC   (Belgium)

^b ASM Japan Co Ltd   (Japan)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; METALLIZING; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PORE SIZE; SPECTROMETRY;

DAMASCENE STRUCTURES;

DIELECTRIC FILMS;

EID: 0034428436     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-612-d5.14.1     Document Type: Article

References (7)

1. Materials, technology, and reliability for advanced interconnects and low-k dielectrics