Organic solution deposition of copper seed layers onto barrier metals

Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D9191-D9196

  Gu, H ^a   Fang, R ^a   O'Keefe, T J ^a   O'Keefe, M J ^a   Shih, W S ^b   Snook, J A M ^b   Leedy, K D ^c   Cortez, R ^c  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^b BREWER SCIENCE INC   (United States)

^c AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; ELECTROCHEMISTRY; ELECTROLYSIS; INTEGRATED CIRCUIT LAYOUT; POLYIMIDES; THIN FILMS;

BARRIER METALS;

SPUTTER DEPOSITION;

EID: 0034428377     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-612-d9.19.1     Document Type: Article

References (7)