Characterization of organic solution deposited copper seed layers on AI(Cu) sputtered thin films

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 5, 1999, Pages 2366-2372

  O'Keefe, M J ^a  

^a AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22844455237     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

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2. E. G. Colgan and K. P. Rodbell, J. Appl. Phys. 75, 3423 (1994).
3. X. W. Lin and D. Pramanik, Solid State Technol. 41, 63 (1998).
4. B. Chin, P. Ding, B. Sun, T. Chiang, D. Angelo, I. Hashim, Z. Xu, S. Edelstein, and F. Chen, Solid State Technol. 41, 141 (1998).