Adapting multichip module foundries for MEMS packaging

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 106-111

  Butler, J T ^a   Bright, V M ^a   Chu, P B ^a   Saia, R J ^a  

^a Air Force Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; FOUNDRIES; MEMS; MICROELECTRONICS; MICROPROCESSOR CHIPS; SURFACE MICROMACHINING;

CHIP ON FLEXES; COST EFFECTIVE; GENERAL ELECTRICS; HIGH DENSITY INTERCONNECTS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); MICROELECTRONIC TECHNOLOGIES; MODULE SYSTEMS; MONOLITHIC INTEGRATION;

MULTICHIP MODULES;

EID: 33748075285     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670763     Document Type: Conference Paper

References (11)

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