Microsystem packaging in 3D

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3224, Issue , 1997, Pages 142-152

  Kelly, G ^a   Alderman, J ^a   Lyden, C ^a   Barrett, J ^a   Morrissey, A ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

3D MCM V; Finite element method; Membrane micropump; Micromachining; Packaging, residual stress

Indexed keywords

COMPOSITE MICROMECHANICS; MACHINING; MICROMACHINING; MICROSYSTEMS; MULTICHIP MODULES; OPTICAL DEVICES; PHILOSOPHICAL ASPECTS; PUMPS; RESIDUAL STRESSES; STRENGTH OF MATERIALS;

3D MCM-V; 3D PACKAGING; FINITE ELEMENTS; MICROMACHINED SILICONS; MICROSYSTEM PACKAGING; PACKAGED MICROSYSTEMS;

FINITE ELEMENT METHOD;

EID: 33749918597     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284509     Document Type: Conference Paper

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