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Volumn 48, Issue 9, 2000, Pages 1482-1487

Millimeter-wave silicon MMIC interconnect and coupler using multilayer polyimide technology

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; INSERTION LOSSES; MILLIMETER WAVE DEVICES; POLYIMIDES; SEMICONDUCTING SILICON; SPURIOUS SIGNAL NOISE;

EID: 0034272187     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.868998     Document Type: Article
Times cited : (14)

References (6)
  • 2
    • 0032122009 scopus 로고    scopus 로고
    • Monolithic packaging concepts for high isolation in circuits and antennas, vol. 46, pp. 900-906, July 1998.
    • R. F Drayton, R. M. Henderson, and L. P. B. Katehi, "Monolithic packaging concepts for high isolation in circuits and antennas," IEEE Trans. Microwave Theory Tech., vol. 46, pp. 900-906, July 1998.
    • IEEE Trans. Microwave Theory Tech.
    • Drayton, R.F.1    Henderson, R.M.2    Katehi, L.P.B.3
  • 4
    • 0033366319 scopus 로고    scopus 로고
    • A novel low-loss, low-crosstalk interconnect for broadband mixed signal silicon MMICs, vol. 47, pp. 1830-1835, Sept. 1999.
    • J. Kirn, Y. Qian, G. Feng, P. Ma, J. Judy, M. F Chang, and T. Itoh, "A novel low-loss, low-crosstalk interconnect for broadband mixed signal silicon MMICs," IEEE Trans. Microwave Theory Tech., vol. 47, pp. 1830-1835, Sept. 1999.
    • IEEE Trans. Microwave Theory Tech.
    • Kirn, J.1    Qian, Y.2    Feng, G.3    Ma, P.4    Judy, J.5    Chang, M.F.6    Itoh, T.7
  • 5
    • 0033356118 scopus 로고    scopus 로고
    • 8th Topical Meeting Electrical Performance of Electronic Packaging, Oct. 1999, pp. 235-238.
    • "High-performance silicon MMIC interconnect for millimeter wave wireless communication," in Proc. IEEE 8th Topical Meeting Electrical Performance of Electronic Packaging, Oct. 1999, pp. 235-238.
    • Proc. IEEE


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.