High-performance silicon MMIC interconnect for millimeter wave wireless communication

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1999, Pages 235-238

  Kim, Juno ^a   Qian, Yongxi ^a   Feng, Guojin ^a   Ma, Pingxi ^a   Chang, M Frank ^a   Itoh, Tatsuo ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSTALK; INSERTION LOSSES; INTERCONNECTION NETWORKS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; POLYIMIDES; SILICON WAFERS; SPURIOUS SIGNAL NOISE; WIRELESS TELECOMMUNICATION SYSTEMS;

SILICON/METAL/POLYIMIDE (SIMPOL) INTERCONNECTS;

ELECTRONICS PACKAGING;

EID: 0033356118     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)