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Volumn 39, Issue 9 A, 2000, Pages 5209-5210

Effect of binder content on shrinkage behavior of a multilayered ceramic substrate

Author keywords

[No Author keywords available]

Indexed keywords

BINDERS; SHRINKAGE; SINTERING; SUBSTRATES;

EID: 0034268370     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.39.5209     Document Type: Article
Times cited : (5)

References (15)
  • 4
    • 33645044548 scopus 로고    scopus 로고
    • ed. R. R. Tummala Chapman & Hall, New York
    • R. R. Tummala: Microelectronics Packaging Handbook, ed. R. R. Tummala (Chapman & Hall, New York, 1997) Vol. 2, p. 353.
    • (1997) Microelectronics Packaging Handbook , vol.2 , pp. 353
    • Tummala, R.R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.