Sensors that can take the heat Part 3: Design techniques for high-temperature applications

Sensors (Peterborough, NH)

Volumn 17, Issue 8, 2000, Pages

  Goetz, Jay ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTROMIGRATION; HIGH TEMPERATURE APPLICATIONS; INTEGRATED CIRCUIT LAYOUT; INTERFACES (COMPUTER); MOS DEVICES; THERMAL EFFECTS;

HIGH IMPEDANCE AMPLIFIER; HIGH TEMPERATURE TOLERANT ELECTRONICS; TEMPERATURE COEFFICIENT; TEMPERATURE INDUCED SENSOR GAIN ERRORS;

SENSORS;

EID: 0034256243     PISSN: 07469462     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (14)

1. Some reliability aspects of high-temperature IC's
2. A new perspective on magnetic field sensing
3. Ceramic dielectric performance under high-temperature life test
4. Designing sensor-based systems for high-temperature environments
5. Long-term behavior of passive components for high-temperature applications-An update
6. High-temperature integrated circuits and passive components for commercial and military applications
7. Military aircraft turbine engine electronics and requirements
8. High-temperature storage and thermal cycling studies of heraeus-cermalloy thick film and dale power wirewound resistors
9. High-temperature storage and thermal shock studies of passive component attach materials
10. Geothermal high temperature instrumentation applications