Ceramic dielectric performance under high temperature life test

1998 4th International High Temperature Electronics Conference, HITEC 1998

Volumn , Issue , 1998, Pages 181-183

  Day, J ^a   Roach, M ^a   Maxwell, J ^b  

^a KD Components   (United States)

^b JM INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; DIELECTRIC MATERIALS; HIGH TEMPERATURE APPLICATIONS; HIGH TEMPERATURE EFFECTS; HIGH-K DIELECTRIC; PROCESS CONTROL;

HIGH TEMPERATURE COMPONENTS; HIGH TEMPERATURE OPERATION LIVES; INDUSTRIAL PROCESS CONTROL; INSULATION RESISTANCE; PERFORMANCE CHARACTERISTICS; RELIABLE PERFORMANCE; TECHNIQUES AND RESULTS; TRADITIONAL MATERIALS;

HIGH TEMPERATURE OPERATIONS;

EID: 84879875319     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HITEC.1998.676785     Document Type: Conference Paper

References (5)

1. McNeal, M. P., Shrous T. R., and Dougherty, J. P., " Dielectrics for High Temperature Dielectrics", Second Intemational High Temperature Electronics Conference, June 1995, pp. XI-9 to XI-14
2. Grzybowski, Dr. R. R., "Characterization, Modeling and Thermal Cycle Life Testing of Large Value Ceramic Capacitors for High Temperature (to 500°C) applications", Third Intemational High Temperature Electronics Conference, June 1996, pp. VI-21 to VI-26
3. Mccluskey, E P., Condra, L., Tom, T., and Fink, J., " Packaging Reliability for High Temperature Electronics: A Material Focus", Third Intemational High Temperature Electronics Conference, June 1996. pp. III-3 to III-10
4. Olsen, D., Wright, R., and Berg, H., "Effects of Intermetallics on the Reliability of Tin Coated Cu, Ag, and Ni Paas", Reliability Physics Symposium, 1975 or 1978, pp. 80-86
5. Kay, P. J., and MacKay, C. A., "Barrier Layers Against Diffusion", Intemational Tin Research Institute, Report 577, 10 September 1979, pp. 169-174