High-temperature storage and thermal shock studies of passive component attach materials

1998 4th International High Temperature Electronics Conference, HITEC 1998

Volumn , Issue , 1998, Pages 68-78

  Naefe, J E ^a   Johnson, R W ^a   Grzyvowski, R R ^b  

^a AUBURN UNIVERSITY   (United States)

^b UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM OXIDE; CERAMIC MATERIALS; ELECTRONICS PACKAGING; ESTERS; EUTECTICS; FILLED POLYMERS; RESISTORS; SILICONES; SILVER; SOLDERING ALLOYS; SUBSTRATES; THERMAL SHOCK;

ALUMINA CERAMIC SUBSTRATES; CERAMIC MULTILAYER CAPACITORS; CERAMIC SUBSTRATES; HIGH TEMPERATURE STORAGE; OPERATING TEMPERATURE; SPECIALTY POLYMERS; STORAGE TEMPERATURES; TEMPERATURE RANGE;

SOLDERING;

EID: 14644415393     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HITEC.1998.676763     Document Type: Conference Paper

References (3)

1. J. Naefe, R. Grzybowski, and R. Wayne Johnson, "High Temperature Storage, Thermal Cycling, and Thermal Shock Studies of Heraeus-Cermalloy Thick Film and Dale Power Wirewound Resistors, " Transactions of the 4th International High Temperature Electronics Conference, June 1998, Albuquerque, New Mexico.
2. W. Dillard, J. Naefe, M. Palmer, and R. Wayne Johnson, "A Test Fixture for High-Temperature, Low Noise Testing of Electronic Components, " Transactions of the 3rd International High Temperature Electronics Conference, p. XIV-9-14, June 1996, Albuquerque, New Mexico.
3. R. R. Grzybowski and Mike Gericke, "500°C Electronics Packaging and Test Fixturing, "Transactions of the 2 International High Temperature Conference, p. IX-41-46, 5-10 June 1994, Charlotte, North Carolina.