New photoresist coating method for 3-D structured wafers

Sensors and Actuators, A: Physical

Volumn 85, Issue 1, 2000, Pages 377-383

  Kutchoukov, V G ^a   Mollinger, J R ^a   Bossche, A ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; COATED MATERIALS; COATING TECHNIQUES; ELECTRODEPOSITION; ETCHING; MICROMACHINING; PHOTORESISTS;

CORNER SMOOTHENING; OMNISPRAY COATING TECHNIQUE; TETRAMETHYL AMMONIUM HYDROXIDE (TMAH) SOLUTION;

SILICON WAFERS;

EID: 0034245932     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00416-7     Document Type: Article

References (12)

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