Passive alignment optical subassemblies for military/aero space fiber-optic transmitter/receiver modules

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 3, 2000, Pages 461-469

  Beranek, Mark W ^a,b   Chan, Eric Y ^b   Chen, Chiu Chao ^b   Davido, Kenneth W ^b   Hager, Harold E ^b   Hong, Chi Shain ^a,b,e   Koshinz, Dennis G ^b   Rassaian, Mostafa ^b   Soares Jr , Harold P ^b   Pierre, Ronald L St ^b   Anthony, Philip J ^a,c,f   Cappuzzo, Mark A ^c   Gates, John V ^c   Gomez, Louis T ^c   Henein, Gerard E ^c   Shmulovich, Joseph ^c   Occhionero, Mark A ^d   Fennessy, Kevin P ^d  

^a IEEE   (United States)

^b BOEING COMPANY   (United States)

^c LUCENT TECHNOLOGIES   (United States)

^d Ceramics Process Systems   (United States)

^e Aero Vision Avionics Inc   (Taiwan)

^f E TEK Dynamics Inc   (United States)

Author keywords

Fiber optics; LED PAC; Molded aluminum nitride; MSM PAC; Optoelectronics; Passive alignment; PIN PAC; Silicon micro optical bench; Solder; VCSEL PAC

Indexed keywords

AVIONICS; INTEGRATED CIRCUIT LAYOUT; LIGHT EMITTING DIODES; MULTICHIP MODULES; MULTIMODE FIBERS; PHOTODIODES; PHOTOLITHOGRAPHY; SEMICONDUCTING ALUMINUM COMPOUNDS; SIGNAL RECEIVERS; SILICON WAFERS; THIN FILMS; TRANSMITTERS;

ALUMINUM NITRIDE; OPTICAL SUBASSEMBLIES; PASSIVE ALIGNMENT CARRIER; REFRACTIVE LENS; SILICON MICROOPTICAL BENCH; VERTICAL CAVITY SURFACE EMITTING LASER;

INTEGRATED OPTOELECTRONICS;

EID: 0034239082     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.861561     Document Type: Article

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