Challenges for developing low-cost avionics/aerospace-grade optoelectronic modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1122-1129

  Chan, E Y ^a   Beranek, M W ^a   Davido, K W ^a   Hager, H E ^a   Hong, C S ^a   St Pierre, R L ^a  

^a BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE APPLICATIONS; AVIONICS; ELECTRONICS PACKAGING; FIBER OPTICS; MILITARY APPLICATIONS; OPTICAL COMMUNICATION; OPTICAL INTERCONNECTS; PERFORMANCE; RELIABILITY;

AVIONICS AEROSPACE OPTOELECTRONIC MODULE APPLICATIONS; HYBRID MANUFACTURING PLANT; OPTOELECTRONIC MODULES;

OPTOELECTRONIC DEVICES;

EID: 0029697103     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (27)