Posithemical-Mechanical Planarization Cleanup Process for Inter Dielectric Films

Journal of the Electrochemical Society

Volumn 142, Issue 1, 1995, Pages 216-226

  Kumar, Promod ^c   Peterman, Shelley ^b   Wilt, Kevin ^b   Eastman, Steve ^b  

^a TEXAS INSTRUMENTS   (United States)

^b SEMATECH   (United States)

^c UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMMONIUM COMPOUNDS; CHEMICAL BONDS; CHEMISTRY; DIELECTRIC FILMS; ELECTROSTATICS; IMPURITIES; PARTICLES (PARTICULATE MATTER); SCRUBBERS;

INTERLAYER DIELECTRIC FILMS; MEGASONIC PROCESS; POSTCHEMICAL MECHANICAL PLANARIZATION CLEANUP PROCESS; POSTPOLISH BUFFING; VAN DER WAALS FORCES; WET WAFER TRANSFER;

CLEANING;

EID: 0029197618     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2043871     Document Type: Article

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