Demonstration of broadband radio frequency sensing: Empirical polysilicon etch rate estimation in a Lam 9400 etch tool

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 4 I, 2000, Pages 1297-1302

  Garvin, Craig ^a   Grizzle, J W ^a  

^a University of Michigan   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EQUIVALENT CIRCUITS; ESTIMATION; MATHEMATICAL MODELS; PERTURBATION TECHNIQUES; PLASMA ETCHING; REACTIVE ION ETCHING; REGRESSION ANALYSIS; SENSORS; SILICON WAFERS;

ETCH RATE; MULTIMODE MICROWAVE EXCITATION; RADIOFREQUENCY SENSING SYSTEM;

MICROELECTRONIC PROCESSING;

EID: 0034225560     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582343     Document Type: Article

References (29)

1. C. Garvin, D. S. Grimard, and J. W. Grizzle, J. Vac. Sci. Technol. A 17, 1377 (1999).
2. M. A. Sobolewski, IEEE Trans. Plasma Sci. 23, 1006 (1995).
3. M. A. Sobolewski, J. K. Olthoff, and Y. C. Wang, J. Appl. Phys. 85, 3966 (1999).
4. J. H. Keller and W. B. Pennebaker, IBM J. Res. Dev. 23, 3 (1979).
5. V. A. Godyak, R. B. Piejak, and B. M. Alexandrovich, J. Appl. Phys. 69, 3455 (1991).
6. J. W. Butlerbaugh, L. D. Baston, and H. H. Sawin, J. Vac. Sci. Technol. A 8, 916 (1990).
7. M. Klick, J. Appl. Phys. 79, 3445 (1996).
8. S. Wurm, W. Preis, and M. Klick, Solid State Technol. 42, 103 (1999).
9. S. Reeves and C. Fullwood, IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE, Piscataway, NJ, 1994), pp. 298-304.
10. D. J. Rose and S. Brown, J. Appl. Phys. 23, 1028 (1952).
11. M. A. Heald and C. B. Wharton, Plasma Diagnostics with Microwaves (Wiley, New York, 1965).
12. P. E. Vandenplas, Electron Waves and Resonances in Bounded Plasmas (Wiley, London, 1968).
13. A. Gilardini, Low Energy Electron Collisions in Gases (Wiley, New York, 1972).
14. C. B. Wharton, R. F. Post, and T. Prosser, Lawrence Radiation Lab Report 5, 238 (1955).
15. R. S. Harp and F. W. Crawford, J. Appl. Phys. 35, 3436 (1964).
16. C. B. Fleddermann, J. H. Beberman, and J. T. Verdeyen, J. Appl. Phys. 58, 1344 (1985).
17. C. A. M. de Vries, A. J. van Roosmalen, and G. C. C. Puylaert, J. Appl. Phys. 57, 4386 (1985).
18. R. M. Moroney, A. J. Lichtenberg, and M. A. Lieberman, J. Appl. Phys. 66, 1618 (1989).
19. M. Haverlag, G. M. W. Kroesen, T. H. J. Bisschops, and F. J. Dehoog, Plasma Chem. Plasma Process. 11, 357 (1991).
20. R. Shadmehr et al., J. Electrochem. Soc. 139, 907 (1992).
21. R. Chen, H. Huang, C. J. Spanos, and M. Gatto, J. Vac. Sci. Technol. A 14, 901 (1996).
22. D. White, D. Boning, G. Butler, and S. W. Barna, IEEE Trans. Semicond. Manuf. 10, 52 (1997).
23. P. Klimecky, D. Schweiger, and J. W. Grizzle, in Abstracts of the 195th Electrochemical Society Meeting (Electrochemical Society, Pennington, NJ, 1999), Vol. 195, p. 214.
24. Y. Ra, S. G. Bradley, and C. H. Chen, J. Vac. Sci. Technol. A 12, 1328 (1994).
25. J. C. Slater, Rev. Mod. Phys. 18, 441 (1946).
26. A. J. Miller, Subset Selection in Regression (Chapman and Hall, New York, 1990).
27. A. Sen and M. Srivastava, Regression Analysis: Theory, Methods, and Applications (Springer, New York, 1990).
28. J. Neter, W. Wasserman, and M. H. Kutner, Applied Linear Statistical Models (Richard D. Irwin, Inc., New York, 1985).
29. M. A. Biondi and S. Brown, Phys. Rev. 75, 1700 (1949).