Reliability and fatigue life prediction of mounted CSP

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 531-536

  Sato, Tomotoshi ^a   Tanaka, Kazumi ^a   Sumikawa, Masato ^a   Yoshioka, Chiyoshi ^a   Yamamura, Keiji ^a   Nukii, Takashi ^a  

^a SHARP CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS;

CHIP SIZE PACKAGES (CSP);

ELECTRONICS PACKAGING;

EID: 0032319170     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)