Optimizing the reliability of Thin Small Outline Package (TSOP) solder joints

American Society of Mechanical Engineers, EEP

Volumn 10-2, Issue , 1995, Pages 675-685

  Darveaux, Robert ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDER JOINT RELIABILITY; THERMAL CYCLING; THERMAL SHOCK TESTING; THIN SMALL OUTLINE PACKAGE (TSOP);

CRACK INITIATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FATIGUE TESTING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; OPTIMIZATION; RELIABILITY; SHOCK TESTING; THERMAL EFFECTS;

SOLDERED JOINTS;

EID: 0029217431     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (25)