New chip scale package with CTE matching to the board

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 219-227

  Schueller, R D ^a   Geissinger, J ^a  

^a Electronic Products   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PRINTED CIRCUIT BOARDS; SOLDERING; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION (CTE);

ELECTRONICS PACKAGING;

EID: 0031328165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)