Correlation of Analytical and Experimental Approaches to Determine Thermally Induced PWB Warpage

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 16, Issue 8, 1993, Pages 986-995

  Ume, Charles ^b   Fulton, Robert E ^b   Stafford, John W ^a  

^a MOTOROLA INC   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONNECTORS; FINITE ELEMENT METHOD; THERMAL EFFECTS;

SHADOW MOIRE METHOD; THERMOMECHANICAL PROPERTIES;

PRINTED CIRCUIT BOARDS;

EID: 0027887097     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.273701     Document Type: Article

References (23)

1. I. M. Danile, T. M. Wang, and J. T. Gotro, “Thermomechanical behavior of multilayer structures in microelectronics,” J. Electron. Packag., vol. 112, pp. 11–15, Mar. 1990.
2. E. Suhir, “Analytical modeling in electronic packaging structures: Its merits shortcomings and iteration with experimental and numerical techniques,” J. Electron. Packag., vol. 111, pp. 157–161, June 1989.
3. S. C. Yao, “PCB thermal analysis,” Printed Circuit Design, pp. 36, 38, 42, 45, Feb. 1989.
4. W. J. Bocci, “Finite element engineering analyses applied to microelectronics,” in Proc. 1986 Nat. Aerospace and Electronics Conferences (NAECON '86), vol. 4, May, 1986, pp. 1150–1153.
5. ANSYS User Manual, vols. 1 and 2, version 4.4A, Swanson Analysis Systems, Inc., Houston, PA, 1990.
6. L. DeBra, “Finite element modeling of plated-through-holes in surface-mount-technology printed wiring boards,” Boeing Electronics Rep. USAF Contract No. F33615-82-C-5071, July 1988.
7. D. D. Gasparaitis and M. W. Lauroesch, “Determining coefficients of thermal expansion of multilayer printed circuit boards,” in Proc. Sixth Ann. Int. Electronics Packaging Conf., 1986, pp. 127–139.
8. D. Greene, et al., “Printed wiring board laminates for multiplane applications,” in Proc. First Int. SAMPE Electronics Conf., May 1989, p. 10.
9. J. Moran, Letter from Oak/Mitsui, Inc. to Chao-pin Yeh of Georgia Tech, September 5, 1989.
10. T. D. Newton, Letter from Norplex-Oak Inc. to F. Juskey of Motorola, Inc., March 21, 1989.
11. C. F. Coombs Jr., Printed Circuits Handbook, Third Ed. New York: McGraw-Hill, 1988.
12. R. E. Fulton, et al., “Multidisciplinary approach to printed wiring board design,” Manufacturing Research Center (MaRC) Rep., Georgia Tech, Sept. 1990.
13. K. Ashbee, Fundamental Principles of Fiber Reinforced Composites. Lancaster, PA: Technomic, 1989.
14. L. A. Carlsson, “Tailoring thermal expansion characteristics of composite laminates,” Dep. Mech. Engineering, Florida Atlantic University, 1987.
15. R. M. Jones, Mechanics of Composite Materials. New York: McGraw-Hill, 1975.
16. S. Timoshenko and S. Woinowsky-Krieger, Theory of Plates and Shells. New York: Wiley, second ed., 1959, pp. 1–580.
17. MATLAB User Manual, The Math Works, Inc., South Natick, MA, 1989.
18. G. N. Skaper and M. Montero, “Thermal expansion determination of copper/fiberglass material in a multilayer circuit board application,” L. J. Broutman & Associates, LTD. Rep. File Number 52–573, June 18, 1991.
19. F. P. Chiang, “Moire methods of strain analysis,” in SESA's Manual on Experimental Stress Analysis, 3rd ed. Aug. 1979, pp. 290–308.
20. T. Martin, et al., “Experimental measurement of PWB warpage,” in Proc. 1991 ASME Winter Ann. Meeting (ASME/WAM) Atlanta, GA, Dec. 1991.
21. C. P. Yeh, et al., “Experimental and analytical investigation of thermally induced warpage for PWBs,” in Proc. IEEE 41th Electronic Component Technology Conf. (ECTC), Oakland, CA, May 1991.
22. R. F. Mousley, 1985, “A shadow Moire technique for the measurement of damage in composites,” J. Composite Structures, vol. 4 pp. 231–244, 1985.
23. A. S. Redner, “Shadow-Moire surface inspection,” Mat. Evaluation, pp. 873–878, July 1990.