SCOPUS 정보 검색 플랫폼

JOM

Volumn 47, Issue 6, 1995, Pages 31-35

Characterizing the temperature dependence of electronic packaging-material properties

(2) Fu, Chia Yu a Ume, Charles a

a GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CHARACTERIZATION; COMPUTER CONTROL; DEFORMATION; ELASTIC MODULI; FINITE ELEMENT METHOD; GLASS FIBER REINFORCED PLASTICS; PRINTED CIRCUIT BOARDS; STRAIN GAGES; STRAIN MEASUREMENT; THERMAL EFFECTS; THERMOANALYSIS;

MATERIAL CHARACTERIZATION; SHEAR MODULI; TEMPERATURE DEPENDENCE;

ELECTRONICS PACKAGING;

EID: 0029325205 PISSN: 10474838 EISSN: 15431851 Source Type: Journal
DOI: 10.1007/BF03221201 Document Type: Article

Times cited : (16)

References (13)

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2
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3
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- Multidisciplinary Approach to Printed Wiring Board Design
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- Fulton, R.E.¹

4
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5
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6
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7
- 84936669751
- Optimizing Strau]n Gage Excitation Levels
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8
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- Strau]n Gage Selection, Criteria, Procedures, Recommendations
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9
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- Measurement of Thermal Expansion Coefficient Using Strau]n Gages
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10
- 0003902029
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11
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- Springer-Verlag, New York
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- Daniel, I.M.¹ Pipes, R.² Whitney, J.³

12
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- Springer-Verlag, New York
- (1975) Mechanics of Composite Materials , pp. 62-66
- Jones, R.M.¹

13
- 84936669748
- (1992) Multidisplinary Approach to Printed Wiring Board Design
- Fulton, R.E.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.