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Volumn 516, Issue , 1998, Pages 135-146
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Modeling electromigration and stress migration damage in advanced interconnect structures
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
COPPER;
DEPOSITION;
DIELECTRIC MATERIALS;
ELECTROMIGRATION;
ETCHING;
FAILURE ANALYSIS;
METALLIZING;
STATISTICAL METHODS;
STRESS ANALYSIS;
DAMASCENE;
STRESS MIGRATION;
SEMICONDUCTOR DEVICE TESTING;
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EID: 0032315036
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (12)
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