Modeling stresses of contacts in wiresaw slicing of polycrystalline and crystalline ingots: Application to silicon wafer production

American Society of Mechanical Engineers, Manufacturing Engineering Division, MED

Volumn 6, Issue , 1997, Pages 439-446

  Li, Ji ^a   Kao, Imin ^a   Prasad, Vish ^a  

^a STONY BROOK UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 6244259610     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (18)

1. Buijs, M. and Houten, K. K. 1993a. A model for lapping of glass. Journal of Materials Science 28:3014-3020.
2. Buijs, M. and Houten, K. K. 1993b. Three-body abrasion of brittle materials as studied by lapping. Wear 166:237-245.
3. Chonan, S.; Jiang, Z. W.; and Yuki, Y. 1993a. Stress analysis of a silicon-wafer slicer cutting the crytal ingot. Journal of Mechanical Design 115:711-717.
4. Chonan, S.; Jiang, Z. W.; and Yuki, Y. 1993b. Vibration and deflection of a silicon-wafer slicer cutting the crystal ingot. Journal of Vibration and Acoutics 115:529-534.
5. Crime, G. M. 1973. The Effect of Environment on The Abrasion of Silicates. Ph.D. Dissertation, University of Sussex.
6. Evans, A. G.; Chesnutt, J. C.; and Nadler, H. 1976. Quasi-static solid particle in damage in brittle solids-ii. indentation friction. Acta Metallurgica 24:867-870.
7. Kao, I.; Prasad, V.; Li, J.; and Bhagavat, M. 1997. Wafer slicing and wire saw manufacturing technology. In NSF Grantees Conference.
8. Lawn, B. R. and Evans, A. G. 1980. Elastic/plastic indentation damage in ceramics: The median/radial crack system. Journal of American Ceramic Society 63:574-581.
9. Lawn, B. R. and Swain, M. V. 1975. Microfracture beneath point indentations in brittle solids. Journal of Materials Science 10:113 - 122.
10. Li, J.; Kao, I.; and Prasad, V. press. Modeling stresses of contacts in wiresaw slicing of polycrystalline and crystalline ingots: Application to silicon wafer production. ASME Journal of Electronic Packaging, In press.
11. Love, A. E. H. 1939. Boussinesq's problem for a rigid cone. Quart. J. Math Pages 161-176.
12. Mal, A. K. and Singh, S. J. 1991. Deformation of Elastic Solids. Prentice Hall.
13. Marshall, D. B.; Lawn, B. R.; and Evans, A. G. 1982. Elastic/plastic indentation damage in ceramics: The lateral crack systems. Journal of the American Ceramic Society 65:561-566.
14. Morre, M. A. and King, F. S. 1980. Abrasive wear of brittle solids. Wear 60:123-140.
15. Sahoo, R. K.; Prasad, V.; Kao, I.; Talbott, J.; and Gupta, K. 1996. Towards an integrated approach for analysis and design of wafer slicing by a wire saw. In Subramania, K., editor 1996, 1996 ASMEIMECE, Manufacturing Science and Engineering. Pages 131-140.
16. Sahoo, R. K.; Prasad, V.; Kao, I.; Talbott, J.; and Gupta, K. 1997. An integrated approach for analysis and design of wafer slicing by a wire saw. ASME Journal of Electronics Packaging (in press).
17. Sneddon, I. N. 1948. Boussinesq's problem for a rigid cone. Proc. Cambridge Phil. Soc. 44:492-507.
18. Sneddon, I. N. 1951. Fourier Transforms. McGraw-Hill Book Company.