Fundamental characteristics of electrostatic wafer chuck with insulating sealant

IEEE Transactions on Industry Applications

Volumn 36, Issue 2, 2000, Pages 510-516

  Yatsuzuka, Kyoko ^a   Hatakeyama, Fumikazu ^a   Asano, Kazutoshi ^a   Aonuma, Shinichiro ^a  

^a YAMAGATA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHUCKS; DIELECTRIC FILMS; ELECTRIC POTENTIAL; ELECTRODES; HEAT TRANSFER; INSULATING MATERIALS; PLASTIC FILMS; SEALANTS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; VACUUM APPLICATIONS;

ELECTROSTATIC WAFER CHUCK;

ELECTROSTATIC DEVICES;

EID: 0033903870     PISSN: 00939994     EISSN: None     Source Type: Journal    
DOI: 10.1109/28.833768     Document Type: Article

References (4)

1. L. D. Hartsough, Electrostatic wafer holding, Solid State Technol., pp. 87-90,Jan. 1993.
2. T. Watanabe and T. Kitabayashi, Effect of additives on the electrostatic force of alumina electrostatic chucks, J. Ceramic Soc. Jpn., vol. 100, no. l,pp. 1-6, 1992.
3. G. A. Wardly, Electrostatic wafer chuck for electron beam microfabrication, Rev. Sci. Instrum., vol. 44, no. 10, pp. 1506-1509, Oct. 1973.
4. K. Asano, F. Hatakeyama, and K. Yatsuzuka, Fundamental study of an electrostatic chuck for silicon wafer handling, in Conf. Rec. IEEE-IAS Anna. Meeting, New Orleans, LA, Oct. 5-9, 1997, pp. 1998-2003.