Localizing power to ground shorts in a chips-first MCM by scanning SQUID microscopy

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2000, Pages 413-419

  Vanderlinde, W E ^a   Cheney, M E ^a   McDaniel, E B ^b   Skinner, K L ^b   Knauss, L A ^c   Frazier, B M ^c   Christen, H M ^c  

^a Microelectronics Research Laboratory   (United States)

^b University Research Foundation   (United States)

^c Neocera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; MICROSCOPIC EXAMINATION; SEMICONDUCTOR DEVICE TESTING; SQUIDS;

GROUND SHORTS;

MULTICHIP MODULES;

EID: 0033749069     PISSN: 00999512     EISSN: None     Source Type: Journal    
DOI: 10.1109/RELPHY.2000.843949     Document Type: Article

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