Designing lead-free solder alloys for advanced electronics assembly

Proceedings of the 1994 Design for Manufacturability Conference

Volumn , Issue , 1994, Pages 27-34

  Knorr, D B ^a   Felton, L E ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING; FAILURE (MECHANICAL); LEAD ALLOYS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; VIBRATIONS (MECHANICAL);

ADVANCED ELECTRONICS ASSEMBLY; LEAD FREE SOLDER ALLOYS; MANUFACTURABILITY; SINGLE CHIP MODULE; TOXIC CONSTITUENTS;

ELECTRONICS PACKAGING;

EID: 0028312629     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)