Mathematical simulation of soft baking in photoresist processing

Journal of the Electrochemical Society

Volumn 147, Issue 5, 2000, Pages 1920-1924

  Hsu, Jyh Ping ^a   Huang, Shi Wei ^a   Tseng, Shiojenn ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b TAMKANG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; BOUNDARY VALUE PROBLEMS; COMPUTER SIMULATION; DIFFUSION; FINITE DIFFERENCE METHOD; MATHEMATICAL TRANSFORMATIONS; MOLECULAR DYNAMICS; ORDINARY DIFFERENTIAL EQUATIONS; PHENOLS; PHOTORESISTS; POLYMETHYL METHACRYLATES; SOLVENTS;

CRESOL NOVOLAK; DIFFUSIVITY; LANDAU TRANSFORMATION; MOLECULAR DIFFUSION; MOVING BOUNDARY PROBLEM; PHOTORESIST PROCESSING; SHERWOOD NUMBER; SOFT BAKING PROCEDURE;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033745628     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1393458     Document Type: Article

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