Mathematical modeling of soft baking in photoresist processing

Journal of the Electrochemical Society

Volumn 145, Issue 12, 1998, Pages 4256-4259

  Lin, Sung Hwa ^a   Liu, Bo Tau ^a   Chen, Wen Chang ^a   Hsu, Jyh Ping ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; PHASE INTERFACES; THIN FILMS;

SOFT BAKING;

PHOTORESISTS;

EID: 0032288057     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838947     Document Type: Article

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