Synthetic criterion for level-1 crack-free package - proposal of a superior package structure

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 71-77

  Inoue, Yumi ^a   Sawada, Kanako ^a   Kawamura, Noriyasu ^a   Sudo, Toshio ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACKS; DELAMINATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; PRODUCT DESIGN; RELIABILITY; STRESS INTENSITY FACTORS; TESTING;

CHIP SIDE SUPPORT; CRACK FREE PACKAGE; PACKAGE CRACKING; RELIABILITY TESTS;

ELECTRONICS PACKAGING;

EID: 0029721490     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)