Metal plasma source ion implantation using a UBM cathode

Surface and Coatings Technology

Volumn 128-129, Issue 1, 2000, Pages 240-244

  Yu, Weidong ^a   Xia, Lifang ^a   Sun, Yue ^a   Sun, Mingren ^a   Ma, Nan ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Ssang Tae Industrial Group Co Ltd   (China)

Author keywords

Depth profile; MePSII; Recoil implantation; UBM cathode

Indexed keywords

COPPER; ION IMPLANTATION; MAGNETIC FIELD EFFECTS; MAGNETRON SPUTTERING; METALLIC FILMS; PLASMA SOURCES; SPUTTER DEPOSITION; SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

RECOIL IMPLANTATION; UNBALANCED MAGNETRON SPUTTERING;

SURFACE TREATMENT;

EID: 0033723135     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(00)00577-6     Document Type: Article

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