Amalgams as alternative microelectronic interconnect materials

American Society of Mechanical Engineers, Manufacturing Engineering Division, MED

Volumn 3, Issue , 1995, Pages 55-63

  Baldwin, D F ^a   Deshmukh, R D ^a   Hau, C S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTRONICS PACKAGING; INTERMETALLICS; MICROELECTRONICS; MICROSTRUCTURE; WETTING;

AMALGAMS; ELECTRONIC INTERCONNECTS;

GALLIUM ALLOYS;

EID: 0029422879     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)