Gallium alloy interconnects for flip-chip assembly applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1143-1150

  Baldwin, Daniel F ^a   Deshmukh, Rajan D ^a   Hau, Christine S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL MICROSTRUCTURE; CURING; ELECTRIC CONNECTORS; ELECTRONIC EQUIPMENT TESTING; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FLIP CHIP DEVICES; HARDNESS; INTERMETALLICS; MICROELECTRONIC PROCESSING; RELIABILITY;

FLIP CHIP ASSEMBLY; GALLIUM ALLOY INTERCONNECTS; INTERCONNECT MICROSTRUCTURE ANALYSIS; LAMINATE INTERCONNECT MATERIALS;

GALLIUM ALLOYS;

EID: 0029696533     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)