Amalgams for Improved Electronics Interconnection

IEEE Micro

Volumn 13, Issue 2, 1993, Pages 46-58

  MacKay, Colin A ^a  

^a Microelectronics Computer Technology Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MERCURY AMALGAMS;

DIE ATTACHMENT; HERMETIC SEALING; SOLDER THERMAL STABILITY;

SOLDERING ALLOYS;

EID: 0027582919     PISSN: 02721732     EISSN: None     Source Type: Journal    
DOI: 10.1109/40.207088     Document Type: Article

References (12)

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3. C.A.MacKay, “Bonding Metallurgies-Amalgams” Tech. Publication P/I 307–87, Microelectronics and Computer Technology Corp., Austin, Texas, 1987.
4. C.A. MacKay, “Parameters and Conditions for Making Usable Amalgams,” Tech. Publication P/I 107–88, MCC, 1988.
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