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Volumn 2, Issue , 2000, Pages 705-708

X-band transmit/receive module overview

Author keywords

[No Author keywords available]

Indexed keywords

WIDE BANDGAP SEMICONDUCTORS; X-BAND TRANSMIT RECEIVE MODULE;

EID: 0033678584     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (16)

References (10)
  • 5
    • 0033366155 scopus 로고    scopus 로고
    • A compact network eliminating parametric oscillations in high power MMIC amplifiers
    • D. Teeter, et al., A Compact Network Eliminating Parametric Oscillations in High Power MMIC Amplifiers, IEEE MTT-S, 1999, pp. 967-970.
    • (1999) IEEE MTT-S , pp. 967-970
    • Teeter, D.1
  • 7
    • 0032668826 scopus 로고    scopus 로고
    • High-power microwave GaN/AlGaN HEMTs on semi-insulating sic substrates
    • April
    • S. T. Sheppard, et al., "High-Power Microwave GaN/AlGaN HEMTs on Semi-Insulating Sic Substrates," IEEE Electron Device Letters, April 1999, pp. 161-163.
    • (1999) IEEE Electron Device Letters , pp. 161-163
    • Sheppard, S.T.1
  • 9
    • 0032299491 scopus 로고    scopus 로고
    • RF and mechanical characterization of flip-chip interconnect
    • December
    • Zhang, et al., "RF and Mechanical Characterization of Flip-Chip Interconnect," IEEE MTT, December, 1998, p. 2269-2275
    • (1998) IEEE MTT , pp. 2269-2275
    • Zhang1
  • 10
    • 0033709654 scopus 로고    scopus 로고
    • Microwave flip chip and BGA technology
    • Bedinger, "Microwave Flip Chip and BGA Technology," IEEE MTT-S 2000.
    • (2000) IEEE MTT-S
    • Bedinger1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.