Integration process of micro electro mechanical polysilicon with CMOS analog/digital circuits

Sensors and Actuators, A: Physical

Volumn 78, Issue 2, 1999, Pages 120-129

  Yee, Youngjoo ^a   Park, Myoungkyu ^b   Lee, Wonchang ^c   Kim, Seokyu ^c   Chun, Kukjin ^c  

^a LG   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

^c Seongbuk gu KIST 136 791   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CMOS INTEGRATED CIRCUITS; DEPOSITION; LINEAR INTEGRATED CIRCUITS; MORPHOLOGY; MOSFET DEVICES; POLYCRYSTALLINE MATERIALS; SEMICONDUCTOR DOPING;

MICROELECTROMECHANICAL POLYCRYSTALLINE SILICON;

SEMICONDUCTING SILICON;

EID: 0033361499     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00234-4     Document Type: Article

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