Equivalent-circuit modeling and verificationof metal-ceramic packages for rf and microwave power transistors

IEEE Transactions on Microwave Theory and Techniques

Volumn 47, Issue 63 PART 1, 1999, Pages 709-714

  Liang, Tao ^a  

^a MOTOROLA INC   (United States)

Author keywords

Ceramic package; Electromagnetic modeling; Electronic packaging; Lumped element equivalent circuit

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; ELECTRIC WIRE; ELECTROMAGNETIC FIELD THEORY; ELECTRONICS PACKAGING; EQUIVALENT CIRCUITS; MICROWAVES; RADIO WAVES;

EQUIVALENT CIRCUIT MODELING; FULL WAVE ELECTROMAGNETIC SIMULATION; METAL CERAMIC PACKAGES; MICROWAVE POWER TRANSISTORS; RADIO FREQUENCY POWER TRANSISTORS;

TRANSISTORS;

EID: 0033359686     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.769340     Document Type: Article

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