The finite-element method for modeling circuits and interconnects for electronic packaging

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 10 PART 2, 1997, Pages 1868-1874

  Polycarpou, Anastasis C ^a   Tirkas, Panayiotis A ^a   Balanis, Constantine A ^a  

^a Arizona State University   (United States)

Author keywords

Electronic packaging; Finite element method; Interconnects; Passive circuits

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; NETWORKS (CIRCUITS);

PASSIVE CIRCUITS;

ELECTRONICS PACKAGING;

EID: 0031249224     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.641784     Document Type: Article

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