PWB build-up technologies: smaller, thinner and lighter

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 3, Issue , 1996, Pages 1460-1468

  Holden, Happy ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; BOARD DENSITY; BOARD THICKNESS; BUILD UP STRUCTURE SYSTEM; BUILD UP TECHNOLOGY; FILM REDISTRIBUTION LAYER; HIGH DENSITY INTERCONNECT; PCMCIA CARD; SEQUENTIAL BONDED FILM; SURFACE LAMINAR CIRCUITS;

COSTS; DENSITY (SPECIFIC GRAVITY); ELECTRONICS PACKAGING; PERSONAL COMPUTERS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SMART CARDS; TECHNOLOGY;

PRINTED CIRCUIT BOARDS;

EID: 0029720482     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)