Electroless copper alternative

Printed Circuit Fabrication

Volumn 20, Issue 2, 1997, Pages 30-35

  Cane, Frank N ^a  

^a Fidelity Chemical Products Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BATH; DRY FILM; ELECTROLESS NICKEL; HOLE METALLIZATION;

ADHESION; CHEMICAL ACTIVATION; EFFLUENT TREATMENT; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; ELECTROPLATING; NICKEL; PRINTED CIRCUIT BOARDS; PROCESS CONTROL; RELIABILITY; THERMAL STRESS; THERMODYNAMIC STABILITY;

PRINTED CIRCUIT MANUFACTURE;

EID: 0031077131     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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5. Passlick, T., German Patent No. 3,304,002 (1983).
6. Okabayashi, Tokyo, Japan, U.S. Patent No. 4,933,010 (19go).
7. Minten, K., G. Pismennaya,Olin Hunt Specialty Products Inc., U.S. Patent No. 4,684,560 (1987).
8. Piano, A., Olin Hunt Specialty Products Inc., U. S. Patent No.4,622,107 (1986).
9. Kronenberg, W., J. Hupe, Blasberg-Oberflachemechnik GmbH, German Patent No. 3,741,490 (1987).
10. Holtzmann, A., J. Relis, Techno Instrument Investments, U.S. Patent No. 4,790,912 (1988).
11. Morrisey, D., F. Takach, R. Zeblinsky, Kollmorgen Technologies, U.S. Patent No. 4,683,036 (1987).
12. Scott, K., E.I. du Pont de Nemeurs and Co., U.S. Patent No. 4,749,052 (1988)
13. Brasch, W., C. Favini, Lea Ronal Inc., U.S. Patent No. 4,759,952 (1988)
14. Roubal, J., Galvanotechnik, Vol. 80, No. 1, pp. 226-230 (1989).