A cost analysis of microvia technologies

Printed Circuit Fabrication

Volumn 20, Issue 6, 1997, Pages 30-56

  Singer, Adam ^a   Bhatkal, Ravi ^a  

^a IBIS Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5944235977     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Neuhaus, Herbert. "Materials Issues for High-Density Substrates," SMTA National Symposium, Emerging Packaging Technologies, Research Triangle Park, NC, November 1996.
2. Moser, David. "Sights Set on Small Holes," Printed Circuit Fabrication, February 1997.
3. Winkel, Heinz. "Cost-Effective Form Factor Reduction," Printed Circuit Fabrication, October 1996.
4. Singer, Adam, Jeff Dieffenbach, and Herbert Neuhaus. "Conventional Versus Build-Up PWB Fabrication: Cost Implications for Electronic Packaging," IEPS Annual Meeting, Austin, TX, October 1996.