Metallization of photosensitive epoxy

Journal of Applied Polymer Science

Volumn 67, Issue 9, 1998, Pages 1639-1645

  Lian, Syh Ming ^a   Wang, Tsung Hsiung ^a   Hung, Aina ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; EPOXY RESINS; ETCHING; METALLIZING; MORPHOLOGY; PHOTOSENSITIVITY;

SOLDER FLOAT TESTS; STUD PULL TESTS;

LAMINATED COMPOSITES;

EID: 0032002172     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19980228)67:9<1639::AID-APP16>3.0.CO;2-P     Document Type: Article

References (15)