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Volumn 38, Issue 12 B, 1999, Pages 7094-7098

Characterization of 193 nm chemically amplified resist during post exposure bake and post exposure delay

Author keywords

193nm lithography; Chemically amplified resist; Concentration of deprotected site; Lithography simulation; Post exposure bake; Post exposure delay

Indexed keywords

COMPUTER SIMULATION; NANOTECHNOLOGY; REFRACTIVE INDEX; SEMICONDUCTOR DEVICE MODELS;

EID: 0033337988     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.38.7094     Document Type: Article
Times cited : (8)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.