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Volumn 38, Issue 12 B, 1999, Pages 7094-7098
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Characterization of 193 nm chemically amplified resist during post exposure bake and post exposure delay
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Author keywords
193nm lithography; Chemically amplified resist; Concentration of deprotected site; Lithography simulation; Post exposure bake; Post exposure delay
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Indexed keywords
COMPUTER SIMULATION;
NANOTECHNOLOGY;
REFRACTIVE INDEX;
SEMICONDUCTOR DEVICE MODELS;
CHEMICALLY AMPLIFIED RESISTS;
PHOTORESISTS;
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EID: 0033337988
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.38.7094 Document Type: Article |
Times cited : (8)
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References (10)
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