Sequential modeling of via formation in photosensitive dielectric materials for MCM-D applications

IEEE Transactions on Semiconductor Manufacturing

Volumn 12, Issue 3, 1999, Pages 345-352

  Kim, Tae Seon ^b   May, Gary S ^a,b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENZOCYCLOBUTENE; FILM RETENTION; FILM THICKNESS; PHOTOSENSITIVE DIELECTRIC MATERIALS; UNIFORMITY; VIA FORMATION WORKCELL;

BUTENES; CHARACTERIZATION; COMPUTER SIMULATION; COSTS; CURING; DIELECTRIC FILMS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; NEURAL NETWORKS; REFRACTIVE INDEX;

MULTICHIP MODULES;

EID: 0033310510     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.778202     Document Type: Article

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