Modeling of via formation by photosensitive dielectric materials for MCM applications

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials

Volumn 2, Issue , 1997, Pages 930-933

  Kim, Tae Seon ^a   May, Gary S ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTRONICS PACKAGING; MULTICHIP MODULES; NEURAL NETWORKS; PHOTOSENSITIVITY; RELIABILITY; THERMAL EFFECTS; THIN FILMS;

BENZOCYCLOBUTENE; PHOTOSENSITIVE POLYMER TECHNOLOGY;

DIELECTRIC MATERIALS;

EID: 0030720573     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)