Low-K porous spin-on-glass

Materials Research Society Symposium - Proceedings

Volumn 565, Issue , 1999, Pages 55-61

  Kohl, Paul A ^a   Padovani, Agnes ^a   Wedlake, Michael ^a   Bhusari, Dhananjay ^a   Allen, Sue Ann Bidstrup ^a   Shick, Robert ^b   Rhodes, Larry ^b  

^a Georgia Institute of Technology   (United States)

^b GOODRICH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIFFUSION IN SOLIDS; ENCAPSULATION; GLASS; ORGANIC POLYMERS; PERMITTIVITY; POROUS SILICON; PYROLYSIS; THERMAL EFFECTS;

AIR GAP STRUCTURES; METHYLSILSESQUIOXANE; SPIN-ON GLASS POLYMER;

DIELECTRIC MATERIALS;

EID: 0033297452     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-565-55     Document Type: Article

References (8)

1. N. P. Hacker, G. Davis, L. Figge, and T. Krajewski, in Low Dielectric Constant Materials III, MRS Symposium Proceedings, Vol. 476, page 25, Eds: C. Case, P. Kohl, T. Kikkawa, and W. Lee (1997).
2. C. T. Chua, G. Sarkar, and X. Hu, J. Electrochem. Soc., in-print.
3. M. J. Loboda, C. M. Grove, and R. F. Schneider, J. Electrochem. Soc., 145. 2861 (1998).
4. AlliedSignal Advanced Materials, "Accuglass 512 Spin-On Glass (SOG)", product bulletin (1992).
5. AlliedSignal Advanced Materials, "Accuspin T-18 Flowable Spin-On Polymer (SOP)", product bulletin (1997).
6. P. A. Kohl, Q. Zhao, K. Patel, D. Schmidt, S. A. Bidstrup, R. Shick, and S. Jayaraman, Electrochem. and Solid-State Lett., 1, 49 (1998).
7. ASTM D150-92, "Standard Test Methods for a c loss Characteristics and Permittivity (dielectric constant) of Solid Electrical Insulating Materials", 1992.
8. H. Mdynen, J. Waeterloos, B. Coenegrachts, T. Gao, J. Grillaert, and L. Van den hove, AlliedSignal Planar96 Conference, Santa Clara (1996).