Electromagnetic wave transmission through lossless electrically conductive adhesive

Journal of Electronics Manufacturing

Volumn 9, Issue 4, 1999, Pages 275-281

  Fu, Y ^a   Liu, J ^a   Willander, M ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; CONDUCTIVE FILMS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTROMAGNETIC WAVE TRANSMISSION; INTEGRATED CIRCUIT LAYOUT; INTERFACES (MATERIALS); MICROPROCESSOR CHIPS; PLASTICS FILLERS; SKIN EFFECT; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

ANISOTROPICALLY CONDUCTIVE ADHESIVES (ACA);

ELECTRONICS PACKAGING;

EID: 0033292498     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313199000192     Document Type: Article

References (13)

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