High frequency measurements and simulations on wire-bonded modules on the sequential build-up boards (SBU's)

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 3, 1998, Pages 478-491

  Sihlbom, Rolf ^b,c   Dernevik, Markus ^d   Lindgren, Mats ^b   Starski, J Piotr ^d   Lai, Zonghe ^a,b   Liu, Johan ^a,b  

^a IEEE

^b SWEREA IVF   (Sweden)

^c Ericsson Microwave Systems AB   (Sweden)

^d CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Cross talk; FR 4; Impedance matching; SBU; Stray capacitance; Wire bonding

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; CROSSTALK; DIELECTRIC LOSSES; ELECTRIC FREQUENCY MEASUREMENT; FINITE DIFFERENCE METHOD; IMPEDANCE MATCHING (ELECTRIC); SEMICONDUCTOR DEVICE TESTING;

SEQUENTIAL BUILD-UP (SBU) BOARDS;

PRINTED CIRCUIT BOARDS;

EID: 0032156985     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.725212     Document Type: Article

References (8)

1. R. Sihlbom "High frequency measurements and simulations on the sequential build-up boards (SBU)-low-cost multilayer carriers," IVF-Rep., 1997.
2. M. Lindgren, P. Carlsson, and R. Sihlbom "Sequential build-up boards (SBU)-low-cost multilayer carriers," IVF-Rep. 97/36.
3. Laser Via Technology for High Density MCM-L Fabrication, Joan Tourné, in Proc. ICEMCM Conf., Denver, CO, 1995, pp. 71-76.
4. H. Holden, "Advanced PWB's: Smaller, thinner, lighter, denser and cheaper," Hewlett-Packard Corp. Tech. Training Course, ISHM-Nordic 33rd Annu. Conf., Helsingör, Denmark, 1996.
5. M. Dernevik, R. Sihlbom, Z. Lai, P. Starski, and J. Liu, "High-frequency measurements and modeling of anisotropic electrically conductive adhesive flip-chip joint," in Proc. Adv. Electron. Packag., Kohala Coast, HI, June 1997, pp. 177-184.
6. R. Sihlbom and J. Liu, "High frequency signal simulation of anisotropically conductive adhesive flip-chip joint," in Proc. Latest Achieve Conductive Adhesive Joining Electron. Packag., Philips, Eindhoven, The Netherlands, Sept. 4, 1995, pp. 197-210.
7. J. Carlsson, "Cross talk on printed circuit boards," SP Rep. 14, 1994.
8. L. Li and J. E. Morris "Electrical conduction models for isotropically conductive adhesive joints," presented at Adhesives Electron., Stockholm, Sweden, 1996.