Cause of the decrease in electromigration resistance in Al/Al3Ti lines

Materials Research Society Symposium - Proceedings

Volumn 563, Issue , 1999, Pages 121-126

  Kameyama, A ^a   Masuzaki, K ^a   Okabayashi, H ^a   Sakata, T ^b   Mori, H ^b  

^a NEC CORPORATION   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINUM ALLOYS; CRYSTAL MICROSTRUCTURE; CURRENT DENSITY; DIFFUSION IN SOLIDS; ELECTRIC RESISTANCE; ELECTROMIGRATION; INTERFACES (MATERIALS); METALLOGRAPHIC MICROSTRUCTURE;

DRIFT VELOCITY; ELECTROMIGRATION RESISTANCE;

ELECTRIC CONTACTS;

EID: 0033284699     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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