Detection of subsurface voids using scanning thermal microscopy

Ultramicroscopy

Volumn 80, Issue 1, 1999, Pages 7-11

  Mills, G ^a   Weaver, J M R ^a   Harris, G ^b   Chen, W ^b   Carrejo, J ^b   Johnson, L ^b   Rogers, B ^b  

^a UNIVERSITY OF GLASGOW   (United Kingdom)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; DEFECTS; IMAGE PROCESSING; SILICA; SURFACES; THERMAL CONDUCTIVITY OF SOLIDS;

SCANNING THERMAL MICROSCOPY; VOIDS;

SCANNING ELECTRON MICROSCOPY;

SILICON DIOXIDE;

ARTICLE; ENERGY; INSTRUMENT; MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SENSOR; SURFACE PROPERTY; THERMAL CONDUCTIVITY;

EID: 0033178010     PISSN: 03043991     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0304-3991(99)00047-9     Document Type: Article

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